The evolution of wave soldering technology: Wave soldering is a mature technology, an efficient large-scale soldering process, which has been widely used in the production of electronic products, and it is still the case today. However, the discreteness and complexity of wave soldering control parameters also make people feel very tricky. The complexity of wave soldering is embodied in the diversification of its process variables, such as transmission speed, flux chemistry, preheating temperature, solder tank temperature, PCB design, solderability of components, PCB and soldering during soldering. Material wave interaction, equipment maintenance and operator training, etc.

Although many test carriers have been designed to evaluate the SMT mounting capability and reflow soldering process operation, there is no comprehensive and statistically convenient test carrier suitable for SMT devices in the wave soldering process. This also fully illustrates the variability and complexity of the wave soldering process.

The wave soldering technology is constantly perfected and improved in the application, the purpose is to pursue the production of perfect wave soldering joints in the first time. Repairing will not improve the quality of the original solder joints, and any repairing of solder joints will cause the quality of the solder joints to degrade, because they will go through a temperature action cycle again, which will increase the thickness of the intermetallic compound.

From the perspective of technological development, the use of reflow soldering technology for the large number of applications of narrow-pitch QFP, area array packaged devices BGA, CSP, and FCOB has become more and more dominant in the interconnection of devices and PCBs. Although this does not mean the disappearance of the wave soldering process, it does make it gradually withdraw from its original dominant position.

Judging from the current situation, via assembly still occupies a certain proportion in some lower-level electronic products in China. The main reason for the continued existence of this state is that many occasions do not require the higher performance of SMT technology. In this case, the through-hole assembly is undoubtedly a low-cost solution, so it is continued to be selected. Therefore, wave soldering technology still occupies a mainstream position in the production of such products.